Apple Signs $30 Billion Broadcom Deal to Expand U.S. Chip Production

Apple has signed a multi-year deal worth more than $30 billion with Broadcom to expand U.S. semiconductor manufacturing. Broadcom will produce over 15 billion custom chips, invest $1.5 billion to expand its Colorado campus, and supply custom ASIC and wireless connectivity components for Apple devices through 2031. The agreement is Apple’s largest investment under its American Manufacturing Program (AMP) and broader $600 billion U.S. investment plan. The partnership also aims to strengthen Apple’s long-term U.S. chip supply chain.