Samsung and Broadcom Sign AI Chip Partnership Worth Over US$200 Billion Through 2030

Samsung Electronics and Broadcom have signed a memorandum of understanding (MoU) for an AI semiconductor partnership expected to exceed US$200 billion through 2030. The collaboration covers advanced memory, sub-2nm chip manufacturing and packaging technologies. The agreement is expected to strengthen Samsung’s foundry business as global demand for AI chips and computing infrastructure continues to grow.